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> 기술정보 > 공정능력 |
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2006 |
2008 |
Production Capa.
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40K
㎡
/Month
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60K ㎡ /Month
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Multi Layer
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18 Layers
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34 Layers
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Build-Up
Structure
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1+N+1
(N=2,4,6,8)
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2+N+2
(N=2,4,6)
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Min. Thickness
of CCL.
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0.10mm/Layer
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0.05mm/layer
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Board Thickness
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0.4 ~ 3.2mm
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0.2 ~ 3.6mm
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Line/Space
(Inner Layer)
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75 ㎛ /75㎛
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50 ㎛ /50㎛
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Line/Space
(Out Layer)
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100 ㎛ /100 ㎛
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75 ㎛ /75 ㎛
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Aspect Ratio
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8 : 1
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10 : 1
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Controlled
Impedance
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±10%
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±5%
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